Out on the line, a flexible electronics run goes sideways the moment the photoresist bake drifts. Across the 300 mm wafer, a few tenths of a degree is all it takes to smear linewidths, and you don’t even catch it until metrology flags the batch—by then, it’s already scrap. What you need is heat you can bank on: temperature that hits the recipe exactly, across the whole substrate. What matters, technically We built this wafer heater around semiconductor-grade thermal control. The core holds ±0.1°C uniformity across the active zone, so every die gets the same thermal budget. The chamber is cleanroom-compatible from Class 1 to Class 100, with surfaces chosen to keep particle count flat. Zero particle generation isn’t a slogan—it’s a design constraint, verified in-situ. And the setpoint repeatability is tight enough that soft bake and hard bake profiles carry over from lot to lot without retuning. Why it holds up in practice Flexible substrates don’t forgive hot spots—warp and delamination show up fast. This heater keeps the wafer plane isothermal, so you maintain dimensional stability while the photoresist cures. The payoff is fewer reworks, higher first-pass yield, and a cycle time you can plan around. Power is managed by fast settle and low thermal mass, so you don’t pay for overshoot every time the recipe steps. You end up with process control you can audit: consistent CD, stable film thickness, and a thermal profile that lines up with what the fab expects. What you need to plan for The unit drops into existing tracks and coat/bake tools, but confirm the footprint and interfaces against your tooling envelope. Commissioning is short—just enough to align ramps and soak times with your resist stack. One constraint worth noting: performance depends on controlled airflow, so don’t put it where laminar flow gets disrupted. Once it’s dialed in, it runs 24/7 with routine preventive checks, and that uniformity spec holds across scheduled PM intervals.